PCB Assembly & Testing
         



548.04 G, 548.07G, 548.10
G/K desk models0


Finesse 2 (13,500 CPH)


Controller


548.30D










Reflow Soldering Systems










 
 
 

Reflow Ovens

Reflow Soldering Systems :- Forced Convection

-548.04 G, 548.07 G, 548.10 G/K desk models

Our well-known desk-models have proved themselves in the manufacturing due to their compact construction and reliable soldering results. With capacities between 0.35m2/h and 2.1m2/h (use-tracing relation 1:1) and with working widths between 18cm and 35cm they are capable for all branches of production, beginning with laboratory use up to bigger series production. Easy and clear operation grants a use without problems. for easy removal of the PCBs a chute is included in the delivery. The transport occursvia a grid belt conveyor. Optional the 548.10 is available with a pin chain conveyor and so is capable for inline production. Our soldering systems offer a maximum air temperature of 2700 C in the peak zone and so they are suitable for the use of lead free solder paste.At the outlet the PCBs will be cooled down via ventilators. Our soltering systems are equipped with a standard soldering and curing program which could be used as basic for creating your own programs.


Heating Chamber :—

Our desk models are all equipped with our wel-proved sliding zone forced convection architecture. the heating process is shown in the graphic.

(1) Inlet
At the inlet the air is sucked in via a non vertical air- shaft by a blower which is adjustable between 50% and 100%.

(2) Inlet
Following the air is led through a radiator to the "peak nozzle".

(3) Pre-heat-phase
After forming the"soldering peak",the ajr cools down fast under the melting point.It streams contrary to the transport direction and forms the "pre-heat" phase.

(4) Inlet-heater
To support the pre-heat, ah additional inlet-heater con be activated. For big heat requirements at the 548.10 a peak support via IR-heater can be switched on.

(1) Inlet
At the inlet, the air will be refed to the cycle again. An internal temperature sensor reports the actual I temperature to the control device. Possible soldering steams are sucked out additionally and can be derived.

Controller :

The 8 bit ┬ÁController 80C51 with a battery backup real- time clock is the main part of the controller.This CPU covers all transducers, setting outputs as well as interfaces for documentation. A user-friendly operation is ensured by only four function completely placed on a filter ensures that side. A separate the application complies with CE standard. The maximum air-keys, whose respective status is displayed on the graphicable LCD. electronics are The power module, accessible from the front temperature is limited to 2700C by software. There is on additional excess temperature protection by hardware to preserve the system from damages in case the chamber sensor is foiling. Thus the working range is suitable for leadfree solder pastes.The software allows the storage of up to 16 different programs and 8 temperature profiles. It covers not only the function programming and regulation mathematics, but also the interface drivers and an integrated profile determination and interpretative program, whose datas are graphically displayed.For the documentation a printer interlace is available. The transmission protocol follows Epson ESC-P or HP-Deskjet.


Reflow Soldering Systems — Forced Convection — 548.30 D, 549.30 B, stand alone

With a capacity of 3.2 m2/h and a use- tracing relation of 1:1, the manufacturing of bigger series is the optimal application for the 548.30 D. The system is equipped with our duplex conveyor (right movement). It combines the advantages of the pin chain conveyor and the grid belt conveyor in one machine. The pin chain conveyor with adjustable width supports theautomatic In-Line production. The grid belt can be used for small and separated PCBs and acts also as a middle support for wide boards while using the pin chain conveyor.The 548.30 D works with forced convection. This allows gentle and even heating of the components. The PCB will be successively cooled down to ambient temperature in a cooling zone.The soldering system is equipped with a curing and a soldering program. These programs can be used as basis for the compilation of new programs.

The 548.30 D is equipped with our mirror zone forced convection architecture. Based on the experience with our sliding zone arranged outer chambers and an additional center chamber for the "pre-heating" phase elongation combined. The temperatures and the blower power of each chamber can be chosen individually. With our mirror zone-heating chamber you can adjust both soldering and adhesive curing profiles.
The 549.30 B is equipped with our mirror zone architecture.Based on our well-proven sliding zone heating chamber, there ore two reflected arranged outer chambers.These reflected chambers form the "Forced Convection" upper heat. For problem solutions with big heat requirements, there are additionally four heating plates as bottom heat available. The temperatures of the two heating chambers and the four heating plates can be chosen individual. The conveyor is realized as chain-led PTFE bags. With our mirror zone heating chamber you can adjust both soldering and adhesive hardening profiles.

The 8 bit µController 8OC51 with a battery back-up real-time clock is the main port of the controller. This CPU covers all transducers, setting outputs as well as interfaces for documentation. A user-friendly operation is ensured by only four function keys, whose respective status is displayed on the graphicable LCD. The a module, accessible from the front side. A separate filter ensures that the application complies with CE standard. The maximum air-temperature is limited to 2700C by software. There is an additional excess temperature protection by hardware to preserve the system from damages in case tile chamber sensor is failing. Thus the working range is suitable for lead free solder pastes.The software allows the storage of up to 16 different programs and 8 temperature profiles. It covers not only the function programming and regulation mathematics, but also the interface drivers and an integrated profile determination and interpretative program, whose datas are graphically displayed.For the documentation a printer interface is available. The transmission protocol follows Epson ESC-P or HP-DeskJet.


Reflow Soldering Systems — 7 ZCR — 7 Zones Convection Reflow System

stand alone —
With a capacity of 2.7m2/h and a use-tracing relation of 1:1, the manufacturing of medium up to bigger series is the optimal application for the 7 ZCR.The system is equipped with a grid belt conveyor or alternatively with a duplex conveyor. The duplex conveyor combines the advantages of the pin chain conveyor and the grid belt conveyor in one machine. The pin chain conveyor supports the automatic in-line production. The grid belt can be used for small separated PCBs and acts also as a middle support for wide boards while using the pin chain conveyor The heating chamber of the 7 ZCR has 4 heating zones, 2 cooling zones and additional bottom heat over the first 4 zones. The heating zones are separated like the following:

Zone 1:— Start up With IR heaters, max 4500C
Zone 2:— Preheating 1 with convection heat, max. 2900C
Zone 3:— Preheating 2 with convection heat, max. 2900C
Zone 4:— Peak zone with convection heat, max. 2900C

ver the complete length of the 4 zones a heating plate for bottom heat is available, max. 25O0C. Thus the 7 ZCR has enough heating capacity for lead free soldering, also for thicker multilayer boards.

All temperatures of the mentioned heating zones are adjustable separately. In the convection zones the power of the blowers is adjustable, too. After the heating zones 2 cooling zones are following, one inside the chamber and one outside which cool down the PCBs gently to ambient temperature via blowers.The infeed of nitrogen inside the peak zone is available as an option.

The operation of the 7 ZCR can be done via the mounted operation panel or via an external PC optionally; Therefore an USB interface is included.The work with the operation panel occurs via a simple user guide with four function keys. whose respective status is displayed on the graphic able LCD. Maximum 16 sets of parameters can be stored as a separate program.For the determination of temperature profiles an optionally socket for a NiCr/Ni thermocouple is available, The profile is then shown on the LCD. Max temperature profiles can be stored. For a more comfortable. 3-channel measuring of temperatures our temperature profilers 570.70 and 570.77 are available additionally.

For the communication with upstream machines a potential free ready contact is included. The optionally PC Software allows the entering of must values, the graphical display of actual values, the storage of unlimited parameter sets as well as the printing of parameter sets.

For more information please contact :- 
primegroup@vsnl.com



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