PCB Assembly & Testing
         

 
   MICRO ASSEMBLY  
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FINEPLACER® femto




FINEPLACER® lambda





FINEPLACER® pico ama





FINEPLACER® matrix ma





FINEPLACER® pico ma

 
 
 

MICRO ASSEMBLY


FINEPLACER® femto
Automated Sub-micron Die Bonder
Up to 0.5 micron accuracy Production platform

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FINEPLACER® lambda
Flexible Sub-micron Die Bonder
Up to 0.5 micron accuracy Application versatility

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FINEPLACER® pico ama
Automated Flip Chip Bonder
Up to 5 micron accuracy High flexibility

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Product Videos






FINEPLACER® matrix ma
Semi-automatic Die Bonder
Up to 3 micron accuracy 300 mm wafer bonder

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FINEPLACER® pico ma
Multi-purpose Die Bonder
Up to 5 micron accuracy Application versatility

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Product Videos







For more information please contact :- 
primegroup@vsnl.com



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